本書依據Altium designer 20版本編寫，詳細介紹了利用Altium designer 20實現原理圖與PCB設計的方法和技巧。本書結合設計實例，配合大量的示意圖，以實用易懂的方式介紹印制電路板設計流程和電路綜合設計的方法。本書注重實踐和應用技巧的分享。全書共23章，主要內容包括：Altium Designer 20全新功能介紹、Altium Designer20軟件概述及安裝、系統參數及軟件環境設置、工程文件管理、PCB封裝庫設計、PCB設計環境及快捷鍵設置、網表、PCB結構設計、布局設計、疊層阻抗設計、電源及地平面設計、規則設置、布線設計、PCB設計后處理、生產文件輸出、光繪文件檢查及CAM350應用、高級技巧應用、USB HUB設計、開關電源PCB設計、攝像頭PCB設計、DDR3 T型和flyby結構的設計技巧和要點、DDR4設計概述及PCB設計要點、FPGA中原理圖與PCB交互布線設計。本書在編寫過程中力求精益求精、淺顯易懂、工程實用性強，通過實例細致了講述了具體的應用技巧及操作方法。
國內頂尖設計公司創始人兼首席技術官。EDA設計智匯館（www.pcbwinner.com)首席講師，為各大高校、電子科技企業進行CAE/高速硬件設計培訓。創辦EDA無憂學院580eda.net和EDA無憂人才網580eda.com，為企業提供精準獵頭和硬件研發人才委培服務。同時在硬件互連設計領域有18年的管理經驗，精通Cadence、Mentor、PADS、AD、HyperLynx等多種PCB設計與仿真工具。擔任IPC中國PCB設計師理事會會員，推動IPC互連設計技術與標準在中國的普及；長期帶領公司PCB設計團隊攻關軍工、航天、通信、工控、醫療、芯片等領域的高精尖設計與仿真項目。出版多本EDA書籍，系列書籍被業界稱為“高速PCB設計寶典”。
目 錄
第 1 章 Altium Designer 20 全新功能及性能改進·····················································（1）
1.1 Altium Designer 20 全新功能概述·············································································（1）
1.2 主題的切換·········································································································（1） 1.3 ActiveRoute 的重大改進·························································································（3） 1.3.1 擴展的 PCB ActiveRoute 面板 ········································································（3） 1.3.2 Route Guide 中的線到線間距 ·········································································（3） 1.3.3 Meander 控制·····························································································（4）
1.3.4 長度調整 ··································································································（4）
1.3.5 支持引腳交換 ····························································································（4）
1.3.6 其他改進 ··································································································（4）
1.4 焊盤或過孔連接方式的單獨設置··············································································（5） 1.5 布線的改進·········································································································（6） 1.5.1 主動防止出現銳角及避免環路 ·······································································（6）
1.5.2 對差分對的走線優化 ···················································································（6）
1.5.3 布線跟隨模式 ····························································································（7）
1.6 Draftsman 功能的改進 ···························································································（8） 1.7 無限制地增加機械層·····························································································（8） 1.8 微孔的設計·········································································································（9） 1.9 元器件的回溯功能································································································（9） 1.10 多板的 PCB 設計 ······························································································（10） 1.10.1 多板設計 2.0 的特點·················································································（10） 1.10.2 具體操作方法·························································································（10）
1.11 高級的疊層管理器 ····························································································（11） 1.12 本章小結 ········································································································（12） 第 2 章 Altium Designer 20 軟件概述及安裝 ··························································（13）
2.1 Altium Designer 的系統配置要求及安裝···································································（13） 2.1.1 系統配置要求 ··························································································（13）
2.1.2 Altium Designer 20 的安裝···········································································（14）
2.2 Altium Designer 20 的激活 ····················································································（17） 2.3 本章小結··········································································································（18） 第 3 章 Altium Designer 20 系統參數及軟件環境設置 ············································（19）
3.1 常用系統參數設置······························································································（19） 3.1.1 關閉不必要的啟動項 ·················································································（19）
3.1.2 中英文版本切換 ·······················································································（20）
3.1.3 高亮模式及交互選擇模式設置 ·····································································（20）
3.1.4 文件關聯開關 ··························································································（21）
3.1.5 軟件的升級及插件的安裝路徑 ·····································································（22）
3.1.6 自動備份設置 ··························································································（22）
3.2 PCB 系統參數的設置 ··························································································（22） 3.2.1 “General”選項卡 ·····················································································（23）
3.2.2 “Display”選項卡······················································································（24）
3.2.3 “Board Insight Display”選項卡 ····································································（24）
3.2.4 “Board Insight Modes 選項卡········································································（25）
3.2.5 “Board Insight Color Overrides”選項卡 ··························································（25）
3.2.6 “DRC Violations Display”選項卡 ·································································（26）
3.2.7 “Interactive Routing”選項卡········································································（27）
3.2.8 “True Type Fonts”選項卡···········································································（28）
3.2.9 “Defaults”選項卡·····················································································（29）
3.2.10 “Layer Colors”選項卡··············································································（30）
3.3 系統參數的保存與調用························································································（30） 3.4 本章小結··········································································································（31） 第 4 章 工程文件管理································································································（32） 4.1 工程的組成·······································································································（32） 4.2 完整工程的創建·································································································（32） 4.2.1 新建工程 ································································································（33）
4.2.2 已存在工程文件的打開與路徑查找 ·······························································（34）
4.2.3 新建或添加原理圖元件庫 ···········································································（35）
4.2.4 新建或添加原理圖 ····················································································（36）
4.2.5 新建或添加封裝庫 ····················································································（36）
4.2.6 新建或添加 PCB·······················································································（37）
4.3 本章小結··········································································································（38） 第 5 章 PCB 封裝庫設計與管理 ·················································································（39） 5.1 PCB 元件封裝的組成 ··························································································（39） 5.2 PCB 封裝庫編輯界面 ··························································································（39） 5.3 2D 標準封裝創建 ·······························································································（40） 5.3.1 向導創建法 ·····························································································（41）
5.3.2 手動創建法 ·····························································································（45）
5.4 PCB 封裝的檢查與報告 ·······················································································（49） 5.5 從PCB 文件生成 PCB 庫 ·····················································································（50） 5.6 PCB 封裝的復制 ································································································（51） 5.7 3D 封裝的創建 ··································································································（51） 5.8 集成庫·············································································································（53） 5.8.1 集成庫的組成及創建 ·················································································（53）
5.8.2 集成庫的分離 ··························································································（55）
5.8.3 集成庫的安裝與移除 ·················································································（56）
5.9 本章小結··········································································································（57） 第 6 章 PCB 用戶界面及快捷鍵運用 ··········································································（58） 6.1 PCB 設計工作界面介紹 ·······················································································（58） 6.1.1 PCB 設計交互界面····················································································（58）
6.1.2 PCB 對象編輯窗口····················································································（59）
6.1.3 PCB 設計常用面板····················································································（59）
6.1.4 PCB 設計工具欄·······················································································（61）
6.2 常用系統快捷鍵·································································································（63） 6.3 快捷鍵的自定義·································································································（64） 6.3.1 Ctrl+左鍵單擊設置法·················································································（64）
6.3.2 菜單選項設置法 ·······················································································（64）
6.4 本章小結··········································································································（65） 第 7 章 網表·············································································································（66） 7.1 原理圖封裝完整性檢查························································································（66） 7.1.1 封裝的添加、刪除與編輯 ···········································································（66）
7.1.2 庫路徑的全局指定 ····················································································（67）
7.2 網表及網表的生成······························································································（69） 7.2.1 網表······································································································（69）
7.2.2 網表的生成 ·····························································································（70）
7.3 網表的導入·······································································································（70） 7.4 本章小結··········································································································（71） 第 8 章 PCB 結構處理 ·······························································································（72） 8.1 板框定義··········································································································（72） 8.2 自定義繪制板框·································································································（74） 8.3 定位孔的放置····································································································（75） 8.4 本章小結··········································································································（76） 第 9 章 布局設計·······································································································（77） 9.1 布局的常用基本操作···························································································（77） 9.1.1 全局操作 ································································································（77）
9.1.2 選擇······································································································（82）
9.1.3 移動······································································································（85）
9.1.4 對齊······································································································（86）
9.2 飛線的使用方法和技巧························································································（87） 9.2.1 顯示 /隱藏整板飛線····················································································（87）
9.2.2 顯示 /隱藏元件飛線····················································································（87）
9.2.3 顯示 /隱藏網絡飛線····················································································（87）
9.2.4 顯示 /隱藏網絡類的飛線··············································································（88）
9.3 選擇過濾器·······································································································（89） 9.4 布局的工藝要求·································································································（90） 9.4.1 特殊器件的布局 ·······················································································（90）
9.4.2 通孔器件的間距要求 ·················································································（90）
9.4.3 壓接器件的工藝要求 ·················································································（91）
9.4.4 PCB 輔助邊與布局····················································································（92）
9.4.5 輔助邊與母板的連接方式：V-CUT 和郵票孔···················································（92）
9.5 布局的基本順序·································································································（93） 9.5.1 交互式布局 ·····························································································（93）
9.5.2 結構件的定位 ··························································································（95）
9.5.3 整板信號流向規劃 ····················································································（98）
9.5.4 模塊化布局 ·····························································································（98）
9.5.5 主要關鍵芯片布局規劃 ·············································································（100）
9.6 布局的常規約束原則··························································································（101） 9.6.1 元件排列原則 ·························································································（101）
9.6.2 按照信號流向布局原則 ·············································································（102）
9.6.3 抑制EMC 干擾源 ····················································································（102）
9.6.4 抑制熱干擾 ····························································································（102）
9.7 本章小結·········································································································（102） 第 10 章 高速多層板的疊層阻抗設計········································································（103） 10.1 PCB 板材及參數特性························································································（103） 10.1.1 覆銅板的定義及結構···············································································（103） 10.1.2 銅箔的定義及應用··················································································（103） 10.1.3 PCB 板材分類························································································（105） 10.1.4 半固化片的形成及特性············································································（106） 10.1.5 PCB 基材常見的性能指標·········································································（108）
10.2 阻抗計算（以一個八層板為例） ·········································································（110） 10.2.1 微帶線阻抗計算·····················································································（110）
10.2.2 帶狀線阻抗計算·····················································································（112）
10.2.3 共面波導阻抗計算··················································································（113）
10.2.4 阻抗計算的幾個注意事項·········································································（114）
10.3 高速多層板的疊層設計思路 ···············································································（115） 10.3.1 合理的層數···························································································（115）
10.3.2 VCC、GND 作為參考平面，兩者的作用與區別·············································（117） 10.3.3 電源層、地層、信號層的相對位置·····························································（118）
10.3.4 基于SI/PI、EMC、DFM 的疊層原則 ··························································（121）
10.4 疊層阻抗設計實例講解 ·····················································································（121） 10.4.1 四層板疊層阻抗設計實例·········································································（123） 10.4.2 六層板疊層阻抗設計實例·········································································（124）
10.4.3 假八層及如何避免假八層設計···································································（127） 10.4.4 八層板疊層阻抗設計實例·········································································（129）
10.5 Altium Designer 20 的疊層管理器介紹···································································（133） 10.6 本章小結 ·······································································································（135） 第 11 章 電源及地平面設計······················································································（136） 11.1 電源和地處理的基本原則 ··················································································（137） 11.1.1 載流能力······························································································（137）
11.1.2 電源通道和濾波·····················································································（138）
11.1.3 直流壓降······························································································（140）
11.1.4 參考平面······························································································（141）
11.1.5 其他要求······························································································（142）
11.2 常規電源的種類及其設計方法 ············································································（143） 11.2.1 電源的種類···························································································（143）
11.2.2 POE 電源介紹及設計方法·········································································（143） 11.2.3 48V 電源介紹及設計方法·········································································（144）
11.2.4 開關電源的設計·····················································································（145）
11.2.5 線性電源的設計·····················································································（147）
11.3 Altium Designer 20 對電源與地平面的分割·····························································（147） 11.3.1 Altium Designer 20 的鋪銅操作 ··································································（149） 11.3.2 Altium Designer 20 內電層的分割實現 ·························································（154）
11.4 本章小結 ·······································································································（154） 第 12 章 規則設置····································································································（155） 12.1 類與類的創建 ·································································································（155） 12.1.1 類的簡介······························································································（155） 12.1.2 網絡類的創建························································································（156） 12.1.3 差分類的創建························································································（158）
12.2 常用PCB 規則設置項目 ····················································································（160） 12.3 電氣規則設置 ·································································································（161） 12.3.1 安全間距規則設置··················································································（161） 12.3.2 規則的使能和優先級設置·········································································（165） 12.3.3 短路規則設置························································································（166） 12.3.4 開路規則設置························································································（167）
12.4 線寬規則設置 ·································································································（167） 12.5 過孔規則設置 ·································································································（170） 12.6 阻焊規則設置 ·································································································（171） 12.7 銅皮規則設置 ·································································································（171） 12.7.1 負片銅皮連接規則設置············································································（171） 12.7.2 通孔焊盤隔離環寬度設置·········································································（173） 12.7.3 正片銅皮連接規劃設置············································································（174）
12.9 DFM 可制造性規則設置····················································································（175） 12.9.1 孔壁與孔壁之間的距離設置······································································（175） 12.9.2 阻焊橋的寬度設置··················································································（175） 12.9.3 絲印與阻焊之間的距離設置······································································（176） 12.9.4 絲印與絲印之間的距離設置······································································（177）
12.10 區域規則設置································································································（177） 12.11 差分規則設置································································································（180） 12.12 規則的導入與導出··························································································（182） 12.13 本章小結······································································································（183） 第 13 章 布線設計····································································································（184） 13.1 網絡及網絡類的顏色管理 ··················································································（184） 13.2 層的管理 ·······································································································（186） 13.3 元素的顯示與隱藏 ···························································································（187） 13.4 特殊粘貼法的使用 ···························································································（188） 13.5 布線的基本操作 ······························································································（189） 13.5.1 走線打孔與換層·····················································································（189） 13.5.2 布線過程中改變線寬···············································································（190） 13.5.3 走線角度切換························································································（190） 13.5.4 實時跟蹤布線長度及布線保護帶顯示··························································（191） 13.5.5 布線模式選擇························································································（192） 13.5.6 總線布線······························································································（193）
13.6 PCB 布線扇孔·································································································（194） 13.7 添加淚滴 ·······································································································（195） 13.8 蛇形走線 ·······································································································（196） 13.8.1 單端蛇形線···························································································（197） 13.8.2 差分蛇形線···························································································（198）
13.9 多種拓撲結構的等長處理 ··················································································（199） 13.9.1 點到點繞線···························································································（199） 13.9.2 Fly_by 結構等長處理···············································································（200） 13.9.3 T 形結構等長處理 ··················································································（201） 13.9.4 From-To 等長法 ·····················································································（202） 13.9.5 xSignals 等長法······················································································（203） 13.10 常見器件 Fanout 處理······················································································（205） 13.10.1 SOP/QFP 等密間距器件的 Fanout······························································（206） 13.10.2 分離器件（小電容）的 Fanout ·································································（207） 13.10.3 分離器件（排阻）的 Fanout ····································································（208） 13.10.4 分離器件（BGA 下小電容）的 Fanout ·······················································（209） 13.10.5 分離器件（Bulk 電容）的 Fanout······························································（209） 13.10.6 BGA 的 Fanout ·····················································································（210）
13.11 常見BGA 布線方法和技巧···············································································（211） 13.11.1 1.0mm pitch BGA 的布線方法和技巧 ·························································（211） 13.11.2 0.8mm pitch BGA 的布線方法和技巧 ·························································（212） 13.11.3 0.65mm pitch BGA 的布線方法和技巧························································（213） 13.11.4 0.5mm pitch BGA 的布線方法和技巧 ·························································（215） 13.11.5 0.4mm pitch BGA 的布線方法和技巧 ·························································（216） 13.12 布線的基本原則及思路····················································································（218） 13.12.1 布線的基本原則 ···················································································（218） 13.12.2 布線的基本順序 ···················································································（218） 13.12.3 布線層面規劃 ······················································································（219） 13.12.4 布線的基本思路 ···················································································（219）
13.13 本章小結······································································································（220） 第 14 章 PCB 設計后處理 ························································································（221） 14.1 調整絲印位號 ·································································································（221） 14.1.1 絲印位號調整的原則及常規推薦尺寸··························································（221） 14.1.2 絲印位號的調整方法···············································································（222）
14.2 距離測量 ·······································································································（223） 14.2.1 點到點距離的測量··················································································（223） 14.2.2 邊緣間距的測量·····················································································（224）
14.3 尺寸標注 ·······································································································（226） 14.3.1 線性標注······························································································（226） 14.3.2 圓弧半徑標注························································································（227）
14.4 輸出光繪前需要檢查的項目和流程 ······································································（228） 14.4.1 基于Check List 的檢查 ············································································（228） 14.4.2 DRC 設置·····························································································（228） 14.4.3 電氣性能檢查設置··················································································（229） 14.4.4 布線檢查設置························································································（230） 14.4.5 Stub 線頭檢查設置··················································································（231） 14.4.6 絲印上阻焊檢查設置···············································································（231） 14.4.7 絲印與絲印交叉或重疊檢查······································································（232） 14.4.8 元件高度檢查設置··················································································（232） 14.4.9 元件間距檢查設置··················································································（232）
14.5 PCB 生產工藝技術文件說明···············································································（233） 14.6 本章小結 ·······································································································（235） 第 15 章 生產文件輸出·····························································································（236） 15.1 裝配圖 PDF 文件的輸出 ····················································································（236） 15.2 生產文件的輸出 ······························································································（240） 15.2.1 Gerber 文件的輸出··················································································（240） 15.2.2 鉆孔文件的輸出·····················································································（243）
15.2.3 IPC 網表的輸出······················································································（243） 15.2.4 貼片坐標文件的輸出···············································································（243）
15.3 本章小結 ·······································································································（245） 第 16 章 光繪文件檢查及 CAM350 常用操作···························································（246）
16.1 光繪文件的導入 ······························································································（246） 16.2 光繪層的排序 ·································································································（247） 16.3 各層電氣屬性的指定 ························································································（248） 16.4 IPC 網表對比，開短路檢查················································································（249） 16.5 鉆孔文件檢查 ·································································································（251） 16.6 最小線寬檢查 ·································································································（252） 16.7 最小線距檢查 ·································································································（253） 16.8 綜合DRC 檢查································································································（253） 16.9 阻焊到線的檢查 ······························································································（254） 16.10 阻焊到絲印的檢查··························································································（255） 16.11 阻焊橋的檢查································································································（255） 16.12 本章小結······································································································（256） 第 17 章 Altium Designer 20 高級設計技巧及其應用 ············································（257）
17.1 FPGA 引腳的調整····························································································（257） 17.1.1 FPGA 引腳調整的注意事項·······································································（257） 17.1.2 FPGA 引腳的調整技巧·············································································（257）
17.2 相同模塊布局布線的方法 ··················································································（261） 17.3 孤銅移除的方法 ······························································································（263） 17.3.1 正片去孤銅···························································································（263） 17.3.2 負片去孤銅···························································································（264）
17.4 檢查線間距時差分間距報錯的處理方法 ································································（266） 17.5 PCB 快速挖槽·································································································（267） 17.5.1 放置鉆孔······························································································（267） 17.5.2 放置板框層 Board Cutout··········································································（268）
17.6 插件的安裝方法 ······························································································（268） 17.7 PCB 文件中的 Logo 添加···················································································（269） 17.8 3D 模型的導出································································································（272） 17.8.1 3D STEP 模型的輸出···············································································（272） 17.8.2 3D PDF 的輸出 ······················································································（273）
17.9 極坐標的應用 ·································································································（273） 17.10 本章小結······································································································（275） 第 18 章 入門案例：USB HUB·················································································（276） 18.1 基本技能 ·······································································································（276） 18.1.1 USB HUB 原理圖設計 ·············································································（276） 18.1.2 USB HUB PCB 設計················································································（276）
18.2 基本知識 ·······································································································（276） 18.2.1 設置差分網絡························································································（276） 18.2.2 設置差分對規則·····················································································（280） 18.2.3 差分對走線···························································································（283） 18.2.4 原理圖與 PCB 交互布局···········································································（283）
18.3 USB 差分線設計原則························································································（284） 18.4 本章小結 ·······································································································（285） 第 19 章 入門案例：開關電源 PCB 設計···································································（286） 19.1 基本技能 ·······································································································（286） 19.1.1 繪制電路原理圖·····················································································（286） 19.1.2 工作原理······························································································（286） 19.1.3 PCB 設計······························································································（289）
19.2 PCB 抗干擾設計······························································································（291） 19.2.1 抑制干擾源···························································································（292） 19.2.2 切斷干擾傳播路徑··················································································（294） 19.2.3 提高敏感器件的抗干擾性能······································································（294）
19.3 本章小結 ·······································································································（295） 第 20 章 進階案例：攝像頭 PCB 設計 ······································································（296） 20.1 基本技能 ·······································································································（296） 20.1.1 IMX274 原理圖設計················································································（296） 20.1.2 IMX274 PCB 設計 ··················································································（296）
20.2 基本知識 ·······································································································（296） 20.2.1 設置差分網絡························································································（296） 20.2.2 設置差分對規則·····················································································（302） 20.2.3 差分對走線···························································································（304） 20.2.4 原理圖與 PCB 交互布局···········································································（306）
20.3 差分線設計原則 ······························································································（307） 20.4 本章小結 ·······································································································（307） 第 21 章 DDR3 內存的相關知識及 PCB 設計方法·····················································（308） 21.1 DDR 內存的基礎知識 ·······················································································（308） 21.1.1 存儲器簡介···························································································（308） 21.1.2 內存相關工作流程與參數介紹···································································（308） 21.1.3 內存容量的計算方法···············································································（312） 21.1.4 DDR、DDR2、DDR3 各項參數介紹及對比 ··················································（312）
21.2 DDR3 互連通路拓撲·························································································（313） 21.2.1 常見互連通路拓撲結構介紹及其種類··························································（313） 21.2.2 DDR3 T 形及 Fly_by 拓撲之應用分析··························································（315） 21.2.3 Write Leveling 功能與 Fly_by 拓撲······························································（317）
21.3 DDR3 信號說明及分組······················································································（318）
21.4 DDR3 四片 Fly_by 結構設計···············································································（320） 21.4.1 布局····································································································（320） 21.4.2 VDD、VREF 和 VTT 等電源處理·······························································（322） 21.4.3 Fly_by 結構的 Fanout 處理········································································（324） 21.4.4 數據線及地址線互連···············································································（325）
21.5 DDR3 兩片 T 形結構設計 ··················································································（325） 21.5.1 兩片DDR3 T 形結構布局·········································································（326）
21.5.2 T 形結構 Fanout 處理···············································································（326） 21.5.3 VTT 上拉端接電子處理 ···········································································（327）
21.6 數據線及地址線等長處理 ··················································································（328） 21.7 內存PCB 設計要點總結 ····················································································（328） 21.8 本章小結 ·······································································································（329） 第 22 章 DDR4 設計概述及 PCB 設計要點介紹 ························································（330） 22.1 DDR4 信號分組·······························································································（330） 22.2 DDR4 布局要求·······························································································（331） 22.3 DDR4 布線要求·······························································································（332） 22.4 DDR4 走線線寬和線間距···················································································（333） 22.5 DDR4 等長要求·······························································································（333） 22.6 DDR4 電源處理·······························································································（334） 22.7 本章小結 ·······································································································（336） 第 23 章 FPGA 中原理圖與 PCB 交互布線設計·························································（337） 23.1 實現交互的準備工作 ························································································（337）
23.2 如何實現 FPGA 原理圖與 PCB 交互設計·······························································（339） 23.2.1 交互設置······························································································（339） 23.2.2 實現交互操作························································································（342）
23.3 原理圖與 PCB 一致 ··························································································（343） 23.4 本章小結 ·······································································································（345）
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